Properties Overview
メスコネクタ
リフロー半田付け端子 (SMT)
コンタクト: 80
ストレート型
銅合金
貴金属メッキ 下地Ni 嵌合側, Snメッキ、下地Ni 結線側
パフォーマンスレベル: 1
液晶高分子（LCP）
製品詳細
Identification
- Category Connectors
- Series har-flex®
- Identification Signal
- Element Female connector
- Description of the contact Straight
Version
- Termination method Reflow soldering termination (SMT)
-
Connection type
Motherboard to daughtercardMezzanine
- Number of contacts 80
- Pack contents Sample
Technical characteristics
- Contact rows 2
- Contact spacing (termination side) 1.27 mm
- Contact spacing (mating side) 1.27 mm
- Stacking height 6.25 mm
- Clearance distance ≥ 0.4 mm
- Creepage distance ≥ 0.4 mm
- Insulation resistance >109 Ω
- Contact resistance < 25 mΩ
- Limiting temperature -55 ... +125 °C
- Insertion force ≤ 64 N
-
Withdrawal force
≥ 12 N≤ 56 N
- Performance level 1
- Mating cycles ≥ 500
- Test voltage Ur.m.s. 0.5 kV
- Isolation group IIIa (175 ≤ CTI < 400)
Material properties
- Material (insert) Liquid crystal polymer (LCP)
- Material (contacts) Copper alloy
-
Surface (contacts)
Noble metal over Ni Mating sideSn over Ni Termination side
- Material flammability class acc. to UL 94 V-0
- RoHS compliant
- ELV status 適合
- China RoHS e
- REACH Annex XVII substances 含まず
- REACH ANNEX XIV substances Not contained
- REACH SVHC substances 含まず
- California Proposition 65 substances Not contained
Commercial data
- Packaging size 1
-
Net weight
2.63 g3.331 g
- Country of origin China
- European customs tariff number 85366990
- GTIN 5713140118201
- eCl@ss 27460201 PCB connector (board connector)
- ETIM EC002637
- UNSPSC 24.0 39121415
Downloads
コネクタパッケージ
