Properties Overview
Carrier for electronic components
Interconnection
PCB assembly (SMD)
Liquid crystal polymer (LCP)
Surface (contacts): Au (≥ 0.05 µm) over Ni (≥ 4 µm) over Cu (5...11 µm)
Product Details
Identificare
- Categoria Surface Mount Device
- Seria 3D-MID
- Element Carrier for electronic components
- Specificație Interconnection
- Caracteristici Other materials or trace layouts on request!
Version
- Fixing Asamblare pe PCB (SMD)
-
Pack contents
Bandă & rolă3400 bucăţi pe rolăCantităţi mai mici disponibile la cerere!
Caracteristici tehnice
- Operating temperature -40 ... +125 °C
- Storage temperature -40 ... +125 °C
Material properties
- Material Polimer cristale lichide (LCP)
- Surface (contacts) Au (≥ 0,05 µm) peste Ni (≥ 4 µm) peste Cu (5...11 µm)
- Length 4,9 mm
- Width 4 mm
- Height 3 mm
- RoHS conform
- ELV status conform
- China RoHS e
- REACH Annex XVII substances Nu este inclus
- REACH ANNEX XIV substances Nu este inclus
- REACH SVHC substances Nu este inclus
- California Proposition 65 substances Nu este inclus
Commercial data
- Packaging size 1.700
- Net weight 0.5 g
- Country of origin Elveţia
- European customs tariff number 85340019
- GTIN 5713140277410
- ETIM EC002637
- eCl@ss 27469090 PCB connection technology (other, unspecified)
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