har-modular® | HARTING Technology Group

Withdrawal force

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‌ 10 N

5
‌ 40 N

5
≤ 10 N

5
≤ 12 N

3
≤ 5 N

5
≤ 6 N

7
≥ 1 N

10
≥ 1.6 N

19

Contact resistance

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≤10 mΩ for inner contact die

10
≤3 mΩ for outer ferrule

10

Isolation group

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I (600 ≤ CTI)

76

Performance level

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1

64
acc. to IEC 60603-2

23

Shielding

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Fully shielded, 360° shielding contact

10

Data rate

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‌ 1 Gbit/s

10
‌ 10 Gbit/s

10
‌ 10 Mbit/s

10
‌ 100 Mbit/s

10
‌ 25 Gbit/s

10
‌ 5 Gbit/s

10

PCB fixing

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With fixing pin

2
With guiding

2
With snap-in clip

4

Railway classification

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F1/I2 acc. to NFF 16-101/102

53

Leading contact on position

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2

2
a1

4
a3

2

Colour (accessories)

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Metallic

4
Yellow

33

Test voltage U_r.m.s.

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0.75 kV

10
1 kV

7
1.55 kV

10
2.5 kV

3

Transmission characteristics

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100GBASE-KR4 Ethernet

10
10GBASE-KR Ethernet

5
40GBASE-KR4 Ethernet

5
Hypertransport 3

10
Infiniband FDR

10
PCIe Gen 2

10
PCIe Gen 3

10
PCIe Gen 4

10
SAS 2.0

10
SAS 3.0

10
SATA 3.2

10
USB 3.0

10
USB 3.1

10

Shielding resistance

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> 100 mΩ

10

Category

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Accessories

39
Connectors

53
Contacts

36
Tools

6

Contact spacing (mating side)

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2.54 mm

7
5.08 mm

8

Connection type

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Extender card

15
Mezzanine

66
Motherboard to daughtercard

63
PCB to cable

30

Termination length

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2.8 mm

1
2.9 mm

2
3 mm

9
4.1 mm

1
4.5 mm

4
4.8 mm

8

Creepage distance

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‌0.25 mm to module edge

3
‌0.35 mm to module edge

2
‌0.65 mm to module edge

2
‌1 mm in the module

11
‌1.2 mm in the module

2
‌1.6 mm to module edge

5
‌1.8 mm to module edge

7
‌2 mm to module edge

5
‌2.05 mm in the module

4
‌3 mm in the module

5
‌4 mm in the module

5
‌4.4 mm in the module

3
‌4.6 mm to module edge

3

Clearance distance

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‌0.25 mm to module edge

3
‌0.35 mm to module edge

2
‌0.65 mm to module edge

2
‌1 mm in the module

11
‌1.2 mm in the module

2
‌1.6 mm to module edge

5
‌1.9 mm to module edge

7
‌2 mm to module edge

5
‌2.05 mm in the module

4
‌3 mm in the module

5
‌4 mm in the module

8
‌4.4 mm to module edge

3

Insulation resistance

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<10¹¹ Ω

53
<10⁹ Ω

10

Manufacturing process

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Turned contacts

36

Return loss

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<14 dB @ 2 GHz

1
<14 dB @ 4 GHz for cables RG 174

1
<15 dB @ 2 GHz for cables RG 188

1
<15 dB @ 2 GHz for cables RG 316

1
<17 dB @ 1 GHz for cables RG 316

1
<17 dB @ 4 GHz

1
<18 dB @ 1 GHz for cables RG 188

2
<19 dB @ 1 GHz

1
<19 dB @ 1 GHz for cables RG 174

1
<19 dB @ 1 GHz for cables RG 316

1
<20 dB @ 2 GHz for cables RG 316

1
<22 dB @ 10 GHz

1
<22 dB @ 2 GHz for cables RG 174

1
<22 dB @ 4 GHz

1
<22 dB @ 6 GHz

1
<23 dB @ 1 GHz for cables RG 316

1
<23 dB @ 2 GHz

1
<25 dB @ 1 GHz for cables RG 174

1
<25 dB @ 2 GHz

1
<26 dB @ 1 GHz

2
<27 dB @ 2 GHz

1
<37 dB @ 1 GHz

1

Termination method

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PCB solder termination

4
Solder/crimp termination

7

Identification

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C9 module

7
F4 module

5
H3 module

3
M1 module

5
P module

7
P spacer

7
T module

7
T spacer

6
flat

2

Number of contacts

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1

5
2

5
3

3
4

5
8

5
9

7

Hot plugging

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No

53

Rated current

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≤ 0.4 A

1
≤ 1.4 A

5
≤ 1.5 A

4
‌ 2 A

7
‌ 6 A

5
≤ 10 A

4
‌ 15 A

3
≤ 20 A

4
≤ 30 A

1
≤ 40 A

10

Material

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Polyamide (PA)

53

Contacts for

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DIN 41612 Bauform M 0+2

26
DIN 41612 Type M

27
DIN 41612 Type M invers

21
DIN 41612 Type M invers flat

1
DIN 41612 Type M-flat

2
DIN 41612 Type MH 21+5

27
har-modular^® M module, female, straight

10
har-modular^® M module, male, angled

17
har-modular^® M module, male, straight

11
har-modular^® M-flat module, female, straight

2
har-modular^® M-flat module, male, straight

1

Rated voltage

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250 V

3
2,800 V

2

Moisture Sensitivity Level (MSL)

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1 acc. to ECA/IPC/JEDEC J-STD-020D

76

Material flammability class acc. to UL 94

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V-0

55

Mating cycles

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≥ 500

84

Details

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Please order contacts separately.

5
Pluggable with male connector

2

Features

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The 2-Row coupler allows several rows of har-modular modules to be coupled into one connector. If several individual connectors between 2 parallel circuit boards are installed, it can happen that due to tolerances when soldering the connector on the two circuit boards, the mating forces increase significantly up to the defect of one connector. This is avoided by coupling the har-modular rows to one connector, even if more than 2 rows are coupled together.

2