Eigenschaften im Überblick
Steckverbinder
Reflowlötanschluss (SMT)
Bemessungsstrom: 1,9 A
Kontakte: 100
Kupferlegierung
Edelmetall über Ni steckseitig, Sn über Ni anschlussseitig
Anforderungsstufe: NM 30 (S4)
Liquid-crystal polymer (LCP)
schwarz
Dieser Artikel ist nicht mehr bestellbar. Sie können den Nachfolger 15041002001000 verwenden.
Produktdetails
Identification
- Category Connectors
- Series Micro Card Edge
- Element Connector
Version
- Termination method Reflow soldering termination (SMT)
-
Connection type
Motherboard to daughtercardMezzanine
- Number of contacts 100
- Pack contents Tape & reel
Technical characteristics
- Contact rows 2
- Contact spacing (termination side) 0.8 mm
- Rated current 1.9 A
- Clearance distance 0.6 mm
- Creepage distance 0.7 mm
- Insulation resistance > 1.5 x 1010 Ω
- Limiting temperature -55 ... +125 °C
- Insertion force < 70 N
- Withdrawal force > 30 N
- Performance level NM 30 (S4)
- Mating cycles ≥ 200
- Test voltage Ur.m.s. 0.6 kV
- Isolation group IIIa (175 ≤ CTI < 400)
- PCB thickness 1.6 mm +0.1
Material properties
- Material (insert) Liquid crystal polymer (LCP)
- Colour (insert) Black
- Material (contacts) Copper alloy
-
Surface (contacts)
Noble metal over Ni Mating sideSn over Ni Termination side
- Layer thickness ≥ 0.76 µm
- Layer thickness ≥ 30 µinch
- Material flammability class acc. to UL 94 V-0
- RoHS compliant
- ELV status compliant
- China RoHS e
- REACH Annex XVII substances Not contained
- REACH ANNEX XIV substances Not contained
- REACH SVHC substances Not contained
- California Proposition 65 substances Yes
-
California Proposition 65 substances
NickelNaphthalene
Commercial data
- Packaging size 1
- Net weight 3.1 g
- Country of origin China
- European customs tariff number 85366990
- GTIN 5713140854673
- eCl@ss 27460201 PCB connector (board connector)
- ETIM EC002637
- UNSPSC 24.0 39121415
Downloads
Download Datenpaket
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