Properties Overview
Connector
Reflow soldering termination (SMT)
Contacts: 20
Copper alloy
Noble metal over Ni Mating side, Sn over Ni Termination side
Performance level: 1
Liquid crystal polymer (LCP)
Black
Product Details
Identification
- Category Connectors
- Series har-flex®
- Identification HD-Card Edge
- Element Connector
Version
- Termination method Reflow soldering termination (SMT)
-
Connection type
Motherboard to daughtercardMezzanine
- Number of contacts 20
- Pack contents Sample
Technical characteristics
- Contact rows 2
- Contact spacing (termination side) 0.8 mm
- Contact spacing (mating side) 0.8 mm
- Data rate 25 Gbit/s
-
Clearance distance
≥0,2 mm Cableado dorsal≥0,53 mm Conector≥0,1 mm Tarjeta hija
-
Creepage distance
≥0.2 mm Backplane≥0.53 mm Connector≥0.1 mm Daughtercard
- Limiting temperature -55 ... +125 °C
- Insertion force ≤ 15 N
- Withdrawal force ≥ 4 N
- Performance level 1
- Mating cycles ≥ 200
- Isolation group IIIa (175 ≤ CTI < 400)
- Moisture Sensitivity Level (MSL) 1 acc. to ECA/IPC/JEDEC J-STD-020D
- Process Sensitivity Level (PSL) R0 acc. to ECA/IPC/JEDEC J-STD-020D
- Coplanarity of contacts ≤ 0.1 mm
Material properties
- Material (insert) Polímero de cristal líquido (LCP)
- Colour (insert) Negro
- Material (contacts) Aleación de cobre
-
Surface (contacts)
Metal noble sobre Ni Lado de acoplamientoSn sobre Ni Lado de terminación
- Material flammability class acc. to UL 94 V-0
- RoHS conforme
- ELV status conforme
- China RoHS e
- REACH Annex XVII substances No incluido
- REACH ANNEX XIV substances No incluido
- REACH SVHC substances No incluido
- California Proposition 65 substances No incluido
Commercial data
- Packaging size 1
- Country of origin China
- European customs tariff number 85366990
- GTIN 5713140205406
- ETIM EC002637
- eCl@ss 27460201 PCB connector (board connector)
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