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Device connectivity
PCB connectors
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Board to board connectors
Motherboard to daughtercard connection
17 23 055 2102
零件號: 17 23 055 2102
har-bus HM Federl. Typ-C m. Schirmbl.
圖片僅作參考,請參閱產品說明。
屬性概述
Dişi konnektör
Press-in sonlandırma
Nominal akım: 1 A
Açılı
Bakır alaşımı
Ni üzerinde asil metal Eşleşme tarafı, Ni Sonlandırma tarafı
Performans seviyesi: 2
Termoplastik reçine, cam elyaf dolgulu
Bej
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零件號: 17 23 055 2102
har-bus HM Federl. Typ-C m. Schirmbl.
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Identification
Category
Connectors
Series
har-
bus
®
HM
Identification
Type C
Element
Female connector
Description of the contact
Angled
Version
Termination method
Press-in termination
Shielding
With upper shield
Connection type
Motherboard to daughtercard
Pack contents
Tube
Technical characteristics
Contact rows
7
Contact spacing (termination side)
2 mm
Contact spacing (mating side)
2 mm
Rated current
1 A
Data rate
≤ 2,500 Mbit/s
Insulation resistance
>10
9
Ω
Contact resistance
≤ 20 mΩ
Limiting temperature
-55 ... +125 °C
Insertion force
≤ 41.25 N
Withdrawal force
≥ 8.25 N
Performance level
2
Test voltage U
r.m.s.
0.75 kV
Isolation group
IIIa (175 ≤ CTI < 400)
PCB thickness
≥1.4 mm
Material properties
Material (insert)
Termoplastik reçine, cam elyaf dolgulu
Colour (insert)
Bej
Material (contacts)
Bakır alaşımı
Surface (contacts)
Ni üzerinde asil metal Eşleşme tarafı
Ni Sonlandırma tarafı
Material flammability class acc. to UL 94
V-0
RoHS
uyumlu
ELV status
uyumlu
China RoHS
e
REACH Annex XVII substances
İçermez
REACH ANNEX XIV substances
İçermez
REACH SVHC substances
İçermez
California Proposition 65 substances
Evet
California Proposition 65 substances
Nikel
Fire protection on railway vehicles
EN 45545-2 (2020-08)
Requirement set with Hazard Levels
R26
Specifications and approvals
UL / CSA
UL 1977 ECBT2.E102079
CSA-C22.2 No. 182.3 ECBT8.E102079
Commercial data
Packaging size
20
Net weight
11 g
Country of origin
Germany
European customs tariff number
85366990
GTIN
5713140198593
eCl@ss
27460201 PCB connector (board connector)
ETIM
EC002637
UNSPSC 24.0
39121415
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所有常見 PCB 軟件設計工具的 20 多種不同格式。整套資料包括封裝、電路符號和 3D CAD 數據。它們可用於將浩亭產品快速輕鬆地整合到 CAx 工程流程中。
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The AAS data is organised in a structured way according to an open standard from IDTA (
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), using a data model that allows different systems and applications to interact with the Asset Administration Shell in a standardised and interoperable way. This enables seamless integration and communication between different systems and applications. Further information can be found
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HARTING Device Connectivity - Chapter 11
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HARTING Device Connectivity
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