Properties Overview
オスコネクタ
リフロー半田付け端子 (SMT)
コンタクト: 26
ストレート型
銅合金
貴金属メッキ 下地Ni 嵌合側, Snメッキ、下地Ni 結線側
パフォーマンスレベル: 1
液晶高分子（LCP）
製品詳細
Identification
- Category Connectors
- Series har-flex®
- Identification Signal
- Element Male connector
- Description of the contact Straight
Version
- Termination method Reflow soldering termination (SMT)
-
Connection type
Motherboard to daughtercardMezzaninePCB to cable
- Number of contacts 26
- Pack contents 250 pieces on reel
Technical characteristics
- Contact rows 2
- Contact spacing (termination side) 1.27 mm
- Contact spacing (mating side) 1,27 mm
- Stacking height 4,85 mm
- Clearance distance ≥ 0.4 mm
- Creepage distance ≥ 0,4 mm
- Insulation resistance >109 Ω
- Contact resistance < 25 mΩ
- Limiting temperature -55 ... +125 °C
- Insertion force ≤ 20,8 N
-
Withdrawal force
≥ 3.9 N≤ 18.2 N
- Performance level 1
- Mating cycles ≥ 500
- Test voltage Ur.m.s. 0,5 kV
- Isolation group IIIa (175 ≤ CTI < 400)
Material properties
- Material (insert) Polímero de cristal líquido (LCP)
- Material (contacts) Aleación de cobre
-
Surface (contacts)
Metal noble sobre Ni Lado de acoplamientoSn sobre Ni Lado de terminación
- Material flammability class acc. to UL 94 V-0
- RoHS conforme
- ELV status conforme
- China RoHS e
- REACH Annex XVII substances No incluido
- REACH ANNEX XIV substances No incluido
- REACH SVHC substances No incluido
- California Proposition 65 substances No incluido
Commercial data
- Packaging size 1
- Net weight 705 g
- Country of origin China
- European customs tariff number 85366990
- GTIN 5713140200401
- eCl@ss 27460201 PCB connector (board connector)
- ETIM EC002637
- UNSPSC 24.0 39121415
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