Properties Overview
Hankontaktdon
Ytmonteringsteknik (SMT)
Kontakter: 8
Rak
Kopparlegering
Ädelmetall över Ni Kopplingssida, Sn över Ni Förbindningssida
Prestandanivå: 1
Flytkristallpolymer (LCP)
This product is available upon request. Please contact your local distribution partner.
Produktinformation
Identification
- Category Connectors
- Series har-flex®
- Identification Signal
- Element Male connector
- Description of the contact Straight
Version
- Termination method Reflow soldering termination (SMT)
-
Connection type
Motherboard to daughtercardMezzaninePCB to cable
- Number of contacts 8
- Pack contents 250 stycken på rulle
Technical characteristics
- Contact rows 2
- Contact spacing (termination side) 1,27 mm
- Contact spacing (mating side) 1,27 mm
- Stacking height 4,85 mm
- Clearance distance ≥ 0,4 mm
- Creepage distance ≥ 0,4 mm
- Insulation resistance >109 Ω
- Contact resistance < 25 mΩ
- Limiting temperature -55 ... +125 °C
- Insertion force ≤ 6,4 N
-
Withdrawal force
≥ 1,2 N≤ 5,6 N
- Performance level 1
- Mating cycles ≥ 500
- Test voltage Ur.m.s. 0.5 kV
- Isolation group IIIa (175 ≤ CTI < 400)
Material properties
- Material (insert) Flytkristallpolymer (LCP)
- Material (contacts) Kopparlegering
-
Surface (contacts)
Ädelmetall över Ni KopplingssidaSn över Ni Förbindningssida
- Material flammability class acc. to UL 94 V-0
- RoHS överensstämmelse
- ELV status överensstämmelse
- China RoHS e
- REACH Annex XVII substances Innehåller ej
- REACH ANNEX XIV substances Innehåller ej
- REACH SVHC substances Innehåller ej
- California Proposition 65 substances Innehåller ej
Commercial data
- Packaging size 1
- GTIN 5713140850002
- eCl@ss 27460201 PCB connector (board connector)
- ETIM EC002637
- UNSPSC 24.0 39121415
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