Eigenschaften im Überblick
Leiterplattenverbinder
Reflowlötanschluss (SMT)
Bemessungsstrom: 1,38 A
Kontakte: 12
Kupferlegierung
Sn über Ni steckseitig, Sn über Ni anschlussseitig
Liquid-crystal polymer (LCP)
schwarz
Produktdetails
Identification
- Category Connectors
- Series har-flex®
- Identification Board IDC
- Element PCB transition connectors
Version
- Termination method Reflow soldering termination (SMT)
- Connection type PCB to cable
- Number of contacts 12
- Pack contents Tape & reel
Technical characteristics
- Conductor cross-section [AWG] AWG 30
- Contact rows 2
- Contact spacing (termination side) 1.27 mm
- Contact spacing (mating side) 0.635 mm
- Rated current 1.38 A
- Rated current @ 85 °C
- Clearance distance 0.4 mm
- Creepage distance 0.4 mm
- Insulation resistance > 2.11 x 109 Ω
- Contact resistance < 10 mΩ
- Limiting temperature -55 ... +125 °C
- Test voltage Ur.m.s. 0.91 kV
- Isolation group IIIa (175 ≤ CTI < 400)
Material properties
- Material (insert) Liquid-crystal polymer (LCP)
- Colour (insert) Black
- Material (contacts) Kupferlegierung
-
Surface (contacts)
Sn over Ni Mating sideSn over Ni Termination side
- Material flammability class acc. to UL 94 V-0
- RoHS compliant
- ELV status konform
- China RoHS e
- REACH Annex XVII substances nicht enthalten
- REACH ANNEX XIV substances nicht enthalten
- REACH SVHC substances nicht enthalten
- California Proposition 65 substances nicht enthalten
Commercial data
- Packaging size 600
- Net weight 2.3 g
- Country of origin China
- European customs tariff number 85366990
- GTIN 5713140838284
- eCl@ss 27460201 PCB connector (board connector)
- UNSPSC 24.0 39121415
Downloads
Download Datenpaket
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