속성 개요
수형 커넥터
리플로우 솔더링 터미네이션 (SMT)
접점: 66
직선형
구리 합금
Ni 귀금속 도금 체결 측면, Ni 주석 도금 터미네이션 사이드
성능 레벨: 1
액정 고분자 (LCP, Liquid crystal polymer)
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제품 상세 정보
Identification
- Category Connectors
- Series har-flex®
- Identification Signal
- Element Male connector
- Description of the contact Straight
Version
- Termination method Reflow soldering termination (SMT)
-
Connection type
Motherboard to daughtercardMezzaninePCB to cable
- Number of contacts 66
- Pack contents 280 pieces on reel
Technical characteristics
- Contact rows 2
- Contact spacing (termination side) 1.27 mm
- Contact spacing (mating side) 1.27 mm
- Stacking height 3.25 mm
- Clearance distance ≥ 0.4 mm
- Creepage distance ≥ 0.4 mm
- Insulation resistance >109 Ω
- Contact resistance < 25 mΩ
- Limiting temperature -55 ... +125 °C
- Insertion force ≤ 52.8 N
-
Withdrawal force
≥ 9.9 N≤ 46.2 N
- Performance level 1
- Mating cycles ≥ 500
- Test voltage Ur.m.s. 0.5 kV
- Isolation group IIIa (175 ≤ CTI < 400)
Material properties
- Material (insert) Liquid-crystal polymer (LCP)
- Material (contacts) Kupferlegierung
-
Surface (contacts)
Edelmetall über Ni steckseitigSn über Ni anschlussseitig
- Material flammability class acc. to UL 94 V-0
- RoHS konform
- ELV status 符合
- China RoHS e
- REACH Annex XVII substances 不包含
- REACH ANNEX XIV substances 不包含
- REACH SVHC substances 不包含
- California Proposition 65 substances 不包含
Commercial data
- Packaging size 1
- GTIN 5713140200043
- eCl@ss 27460201 PCB connector (board connector)
- ETIM EC002637
- UNSPSC 24.0 39121415
다운로드
Download Package
Knowledge
0
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