Método de terminación
Reflow soldering termination (SMT)
Tipo de conexión
Motherboard to daughtercard
Mezzanine
Número de contactos
5
Detalles
According to IEC 61984, it is an unencapsulated connector. Protection against electric shock must be ensured by the type of installation by the user.
Contenidos del paquete
Sample
Technical characteristics
Distancia entre contactos (lado de terminación)
2.54 mm
Distancia entre contactos (lado de acoplamiento)
2.54 mm
Altura de apilamiento
9.05 mm
Corriente nominal
20 A
Voltaje nominal
180 V
Rated voltage
acc. to IEC 60664-1
Tensión de choque nominal
1.5 kV
Nivel de contaminación
2
Clearance distance
≥1.74 mm
Creepage distance
≥1.74 mm PCB
≥1.89 mm Connector
Resistencia de aislamiento
>1010 Ω
Resistencia de contacto
≤ 25 mΩ
Temperatura de limitación
-55 ... +125 °C
Performance level
1
Ciclos de conexión
≥ 500
Tensión de prueba Ur.m.s.
1.39 kV
Grupo de aislamiento
IIIa (175 ≤ CTI < 400)
Moisture Sensitivity Level (MSL)
1 acc. to ECA/IPC/JEDEC J-STD-020D
Process Sensitivity Level (PSL)
R0 acc. to ECA/IPC/JEDEC J-STD-020D
Coplanarity of contacts
0.1 mm
Material properties
Material (insert)
Liquid crystal polymer (LCP)
Colour (insert)
Black
Material (contacts)
Copper alloy
Surface (contacts)
Noble metal over Ni Mating side
Sn over Ni Termination side
Material flammability class acc. to UL 94
V-0
RoHS
compliant
ELV status
conforme
China RoHS
e
REACH Annex XVII substances
No incluido
REACH ANNEX XIV substances
Not contained
REACH SVHC substances
No incluido
California Proposition 65 substances
Not contained