Caracteristici
The sample packaging is not suitable for automated assembly.
Versiune
Metoda de terminaţie
Reflow soldering termination (SMT)
Tip conexiune
Motherboard to daughtercard
Mezzanine
Număr de contacte
12
Detalii
According to IEC 61984, it is an unencapsulated connector. Protection against electric shock must be ensured by the type of installation by the user.
Conţinut pachet
Sample
Technical characteristics
Spaţiu între contacte (partea terminaţiilor)
2.54 mm
Spaţiu între contacte (parte de cuplare)
2.54 mm
Înălțime de stivuire
9.05 mm
Curent nominal
18 A
Tensiune nominală
180 V
Rated voltage
acc. to IEC 60664-1
Tensiune de impuls nominală
1.5 kV
Grad de poluare
2
Clearance distance
≥1.74 mm
Creepage distance
≥1.74 mm PCB
≥1.89 mm Connector
Rezistenţă izolaţie
>1010 Ω
Rezistenţă de contact
≤ 25 mΩ
Temperatura de limitare
-55 ... +125 °C
Performance level
1
Cicluri de cuplare
≥ 500
Tensiune de test Ur.m.s.
1.39 kV
Isolation group
IIIa (175 ≤ CTI < 400)
Moisture Sensitivity Level (MSL)
1 acc. to ECA/IPC/JEDEC J-STD-020D
Process Sensitivity Level (PSL)
R0 acc. to ECA/IPC/JEDEC J-STD-020D
Coplanarity of contacts
0.1 mm
Material properties
Material (insert)
Liquid crystal polymer (LCP)
Colour (insert)
Black
Material (contacts)
Copper alloy
Surface (contacts)
Noble metal over Ni Mating side
Sn over Ni Termination side
Material flammability class acc. to UL 94
V-0
RoHS
compliant
ELV status
compliant
China RoHS
e
REACH Annex XVII substances
Not contained
REACH ANNEX XIV substances
Not contained
REACH SVHC substances
Not contained
California Proposition 65 substances
Not contained