The sample packaging is not suitable for automated assembly.
Sürüm
Sonlandırma yöntemi
Reflow soldering termination (THR)
Bağlantı türü
Motherboard to daughtercard
Extender card
Kontak sayısı
5
Ayrıntılar
According to IEC 61984, it is an unencapsulated connector. Protection against electric shock must be ensured by the type of installation by the user.
Paket içeriği
Sample
Technical characteristics
Kontak aralığı (sonlandırma tarafı)
2.54 mm
Kontak aralığı (eşleşme tarafı)
2.54 mm
Nominal akım
22 A
Çalışma Gerilimi
180 V
Rated voltage
acc. to IEC 60664-1
Nominal darbe gerilimi
1.5 kV
Kirlilik derecesi
2
Clearance distance
≥0.94 mm
Creepage distance
≥0.94 mm PCB
≥1.89 mm Connector
Yalıtım direnci
>1010 Ω
Kontak direnci
≤ 25 mΩ
Sıcaklık sınırlaması
-55 ... +125 °C
Performance level
1
Eşleşme döngüsü
≥ 500
Test gerilimi Ur.m.s.
0.84 kV
Yalıtım grubu
IIIa (175 ≤ CTI < 400)
Moisture Sensitivity Level (MSL)
1 acc. to ECA/IPC/JEDEC J-STD-020D
Process Sensitivity Level (PSL)
R0 acc. to ECA/IPC/JEDEC J-STD-020D
Coplanarity of contacts
0.1 mm
Material properties
Material (insert)
Liquid crystal polymer (LCP)
Colour (insert)
Black
Material (contacts)
Copper alloy
Surface (contacts)
Noble metal over Ni Mating side
Sn over Ni Termination side
Material flammability class acc. to UL 94
V-0
RoHS
compliant
ELV status
compliant
China RoHS
e
REACH Annex XVII substances
Not contained
REACH ANNEX XIV substances
Not contained
REACH SVHC substances
Not contained
California Proposition 65 substances
Not contained