Resumen de caracterísiticas
Connector
Low-profile
Reflow soldering termination (SMT)
Rated current: 5 A
Male
Size: D-Sub 2
Liquid crystal polymer (LCP), Shell: steel, nickel plated
Black
Contacts: 15
Copper alloy, Ground: Zinc die-cast
Noble metal over Ni
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Detalles del producto
Identification
- Category Connectors
- Series D-Sub
- Identification Standard
- Element Connector
- Specification Low-profile
-
Description of the contact
StampedAngled
Version
- Termination method Reflow soldering termination (SMT)
- Gender Male
- Size D-Sub 2
- Connection type Motherboard to daughtercard
- Number of contacts 15
- Locking type Fixing flange with fitted screw lock 4-40 UNC
- Pack contents 160 pieces on reel
Technical characteristics
- Distance between rows 2.84 mm
- Contact spacing (termination side) 2.76 mm
- Rated current 5 A
- Clearance distance ≥ 1 mm
- Creepage distance ≥ 1 mm
- Insulation resistance > 5 x 109 Ω
- Contact resistance ≤ 25 mΩ
- Tightening torque ≤0.4 Nm Locking screw
- Limiting temperature -55 ... +125 °C (during reflow soldering max. +240 °C for 30 s)
- Insertion force ≤ 50 N
-
Withdrawal force
≥ 4.5 N≤ 33 N
-
Performance level
2acc. to CECC 75301-802
- Mating cycles ≥ 250
- Test voltage Ur.m.s. 1 kV
- Isolation group IIIa (175 ≤ CTI < 400)
- PCB thickness ≥1.6 mm
- Installation height 3.6 mm
- Hot plugging No
- Moisture Sensitivity Level (MSL) 1 acc. to ECA/IPC/JEDEC J-STD-020D
- Process Sensitivity Level (PSL) R0 acc. to ECA/IPC/JEDEC J-STD-020D
Material properties
-
Material (insert)
Liquid crystal polymer (LCP)Shell: steel, nickel plated
- Colour (insert) Black
-
Material (contacts)
Copper alloyGround: Zinc die-cast
- Surface (contacts) Noble metal over Ni
- Material flammability class acc. to UL 94 V-0
Commercial data
- Packaging size 1
- Country of origin China
- European customs tariff number 85366990
- ETIM EC001136
- eCl@ss 27440214 D-Sub coupler
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