Eigenschaften im Überblick
Federleiste
Reflowlötanschluss (SMT)
Kontakte: 26
gewinkelt
Kupferlegierung
Edelmetall über Ni steckseitig, Sn über Ni anschlussseitig
Anforderungsstufe: 1
Liquid-crystal polymer (LCP)
Produktdetails
Identification
- Category Connectors
- Series har-flex®
- Identification Signal
- Element Female connector
- Description of the contact Angled
Version
- Termination method Reflow soldering termination (SMT)
-
Connection type
Motherboard to daughtercardExtender card
- Number of contacts 26
- Pack contents 560 pieces on reel
Technical characteristics
- Contact rows 2
- Contact spacing (termination side) 1.27 mm
- Contact spacing (mating side) 1,27 mm
- Clearance distance ≥ 0,4 mm
- Creepage distance ≥ 0,4 mm
- Insulation resistance >109 Ω
- Contact resistance < 25 mΩ
- Limiting temperature -55 ... +125 °C
- Insertion force ≤ 20,8 N
-
Withdrawal force
≥ 3,9 N≤ 18,2 N
- Performance level 1
- Mating cycles ≥ 500
- Test voltage Ur.m.s. 0,5 kV
- Isolation group IIIa (175 ≤ CTI < 400)
Material properties
- Material (insert) Liquid-crystal polymer (LCP)
- Material (contacts) Kupferlegierung
-
Surface (contacts)
Edelmetall über Ni steckseitigSn über Ni anschlussseitig
- Material flammability class acc. to UL 94 V-0
- RoHS konform
- ELV status konform
- China RoHS e
- REACH Annex XVII substances nicht enthalten
- REACH ANNEX XIV substances nicht enthalten
- REACH SVHC substances nicht enthalten
- California Proposition 65 substances nicht enthalten
Commercial data
- Packaging size 1
- Net weight 1,780 g
- Country of origin China
- European customs tariff number 85366990
- GTIN 5713140118867
- eCl@ss 27460201 PCB connector (board connector)
- ETIM EC002637
- UNSPSC 24.0 39121415
Downloads
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