Eigenschaften im Überblick
Messerleiste
Reflowlötanschluss (SMT)
Kontakte: 28
gewinkelt
Kupferlegierung
Edelmetall über Ni steckseitig, Sn über Ni anschlussseitig
Anforderungsstufe: 1
Liquid-crystal polymer (LCP)
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Produktdetails
Identification
- Category Connectors
- Series har-flex®
- Identification Signal
- Element Male connector
- Description of the contact Angled
Version
- Termination method Reflow soldering termination (SMT)
-
Connection type
마더보드와 도터보드 연결익스텐더 카드PCB와 케이블 간 연결
- Number of contacts 28
- Pack contents 릴(reel) 하나당 560 개
Technical characteristics
- Contact rows 2
- Contact spacing (termination side) 1.27 mm
- Contact spacing (mating side) 1.27 mm
- Clearance distance ≥ 0.4 mm
- Creepage distance ≥ 0.4 mm
- Insulation resistance >109 Ω
- Contact resistance < 25 mΩ
- Limiting temperature -55 ... +125 °C
- Insertion force ≤ 22.4 N
-
Withdrawal force
≥ 4.2 N≤ 19.6 N
- Performance level 1
- Mating cycles ≥ 500
- Test voltage Ur.m.s. 0.5 kV
- Isolation group IIIa (175 ≤ CTI < 400)
Material properties
- Material (insert) 액정 고분자 (LCP, Liquid crystal polymer)
- Material (contacts) 구리 합금
-
Surface (contacts)
Ni 귀금속 도금 체결 측면Ni 주석 도금 터미네이션 사이드
- Material flammability class acc. to UL 94 V-0
- RoHS 준수
- ELV status 준수
- China RoHS e
- REACH Annex XVII substances no
- REACH ANNEX XIV substances no
- REACH SVHC substances no
- California Proposition 65 substances no
Commercial data
- Packaging size 1
- GTIN 5713140200746
- eCl@ss 27460201 PCB connector (board connector)
- ETIM EC002637
- UNSPSC 24.0 39121415
Downloads
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