Features
Méthode de raccordement des dispositifs de retenue : SMT
Version
Termination method
Raccordement par soudage par refusion (THR)
Connection type
Carte mère à carte fille
Mezzanine
Number of contacts
5
Details
Il s'agit d'un connecteur non encapsulé conforme à la norme IEC 61984. La protection contre les décharges électriques doit être assurée par les méthodes propres à l'utilisateur.
Pack contents
Exemple
Technical characteristics
Contact spacing (termination side)
2,54 mm
Contact spacing (mating side)
2,54 mm
Stacking height
3.25 mm
Rated current
20 A
Rated voltage
180 V
Rated voltage
acc. to IEC 60664-1
Rated impulse voltage
1.5 kV
Pollution degree
2
Clearance distance
≥0.94 mm
Creepage distance
≥0.94 mm PCB
≥1.89 mm Connector
Insulation resistance
>1010 Ω
Contact resistance
≤ 25 mΩ
Limiting temperature
-55 ... +125 °C
Performance level
1
Mating cycles
≥ 500
Test voltage Ur.m.s.
0.84 kV
Isolation group
IIIa (175 ≤ CTI < 400)
Moisture Sensitivity Level (MSL)
1 acc. to ECA/IPC/JEDEC J-STD-020D
Process Sensitivity Level (PSL)
R0 acc. to ECA/IPC/JEDEC J-STD-020D
Coplanarity of contacts
0.1 mm
Material properties
Material (insert)
Liquid crystal polymer (LCP)
Colour (insert)
Black
Material (contacts)
Copper alloy
Surface (contacts)
Noble metal over Ni Mating side
Sn over Ni Termination side
Material flammability class acc. to UL 94
V-0
RoHS
compliant
ELV status
compliant
China RoHS
e
REACH Annex XVII substances
Not contained
REACH ANNEX XIV substances
Not contained
REACH SVHC substances
Not contained
California Proposition 65 substances
Not contained