속성 개요
수형 커넥터
리플로우 솔더링 터미네이션 (SMT)
접점: 28
앵글형
구리 합금
Ni 귀금속 도금 체결 측면, Ni 주석 도금 터미네이션 사이드
성능 레벨: 1
액정 고분자 (LCP, Liquid crystal polymer)
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제품 상세 정보
Identification
- Category Connectors
- Series har-flex®
- Identification Signal
- Element Male connector
- Description of the contact Angled
Version
- Termination method Reflow soldering termination (SMT)
-
Connection type
Motherboard to daughtercardExtender cardPCB to cable
- Number of contacts 28
- Pack contents 560 piezas en bobina
Technical characteristics
- Contact rows 2
- Contact spacing (termination side) 1,27 mm
- Contact spacing (mating side) 1,27 mm
- Clearance distance ≥ 0,4 mm
- Creepage distance ≥ 0,4 mm
- Insulation resistance >109 Ω
- Contact resistance < 25 mΩ
- Limiting temperature -55 ... +125 °C
- Insertion force ≤ 22,4 N
-
Withdrawal force
≥ 4,2 N≤ 19,6 N
- Performance level 1
- Mating cycles ≥ 500
- Test voltage Ur.m.s. 0,5 kV
- Isolation group IIIa (175 ≤ CTI < 400)
Material properties
- Material (insert) Polímero de cristal líquido (LCP)
- Material (contacts) Aleación de cobre
-
Surface (contacts)
Metal noble sobre Ni Lado de acoplamientoSn sobre Ni Lado de terminación
- Material flammability class acc. to UL 94 V-0
- RoHS conforme
- ELV status conforme
- China RoHS e
- REACH Annex XVII substances No incluido
- REACH ANNEX XIV substances No incluido
- REACH SVHC substances No incluido
- California Proposition 65 substances No incluido
Commercial data
- Packaging size 1
- GTIN 5713140200746
- eCl@ss 27460201 PCB connector (board connector)
- ETIM EC002637
- UNSPSC 24.0 39121415
다운로드
Download Package
Knowledge
0
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