Eigenschaften im Überblick
Federleiste
Reflowlötanschluss (SMT)
Kontakte: 10
gerade
Kupferlegierung
Edelmetall über Ni steckseitig, Sn über Ni anschlussseitig
Anforderungsstufe: 1
Liquid-crystal polymer (LCP)
Produktdetails
Identification
- Category Connectors
- Series har-flex®
- Identification Signal
- Element Female connector
- Description of the contact Straight
Version
- Termination method Reflow soldering termination (SMT)
-
Connection type
Motherboard to daughtercardMezzanine
- Number of contacts 10
- Pack contents Sample
Technical characteristics
- Contact rows 2
- Contact spacing (termination side) 1.27 mm
- Contact spacing (mating side) 1.27 mm
- Stacking height 9.05 mm
- Clearance distance ≥ 0.4 mm
- Creepage distance ≥ 0.4 mm
- Insulation resistance >109 Ω
- Contact resistance < 25 mΩ
- Limiting temperature -55 ... +125 °C
- Insertion force ≤ 8 N
-
Withdrawal force
≥ 1.5 N≤ 7 N
- Performance level 1
- Mating cycles ≥ 500
- Test voltage Ur.m.s. 0.5 kV
- Isolation group IIIa (175 ≤ CTI < 400)
Material properties
- Material (insert) Liquid crystal polymer (LCP)
- Material (contacts) Copper alloy
-
Surface (contacts)
Noble metal over Ni Mating sideSn over Ni Termination side
- Material flammability class acc. to UL 94 V-0
- RoHS compliant
- ELV status compliant
- China RoHS e
- REACH Annex XVII substances Not contained
- REACH ANNEX XIV substances Not contained
- REACH SVHC substances Not contained
- California Proposition 65 substances Not contained
Commercial data
- Packaging size 1
- Net weight 1 g
- Country of origin China
- European customs tariff number 85366990
- GTIN 5713140118355
- eCl@ss 27460201 PCB connector (board connector)
- ETIM EC002637
- UNSPSC 24.0 39121415
Downloads
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