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har-flex HD-Card Edge 80 SMT hold PL1
Connectors, Connector, Reflow soldering termination (SMT), Contacts: 80, Copper alloy, Noble metal over Ni, Mating side, Sn over Ni, Termination side, Performance level: 1, Liquid crystal polymer (LCP), Black
N.º de referencia: 15 04 080 2601 000
- Category Connectors
- Series har-flex®
- Identification HD-Card Edge
- Element Connector
- Features Termination method of hold downs: SMT
- Termination method Reflow soldering termination (SMT)
-
Connection type
Motherboard to daughtercardMezzanine
- Number of contacts 80
- Pack contents 200 pieces on reel
- Contact rows 2
- Contact spacing (termination side) 0.8 mm
- Contact spacing (mating side) 0.8 mm
- Data rate 25 Gbit/s
-
Clearance distance
≥0.2 mm Backplane≥0.53 mm Connector≥0.1 mm Daughtercard
-
Creepage distance
≥0.2 mm Backplane≥0.53 mm Connector≥0.1 mm Daughtercard
- Limiting temperature -55 ... +125 °C
- Insertion force ≤ 55 N
- Withdrawal force ≥ 16 N
- Performance level 1
- Mating cycles ≥ 200
- Isolation group IIIa (175 ≤ CTI < 400)
- Moisture Sensitivity Level (MSL) 1 acc. to ECA/IPC/JEDEC J-STD-020D
- Process Sensitivity Level (PSL) R0 acc. to ECA/IPC/JEDEC J-STD-020D
- Coplanarity of contacts ≤ 0.13 mm
- Material (insert) Liquid crystal polymer (LCP)
- Colour (insert) Black
- Material (contacts) Copper alloy
-
Surface (contacts)
Noble metal over Ni Mating sideSn over Ni Termination side
- Material flammability class acc. to UL 94 V-0
- China RoHS e
- Packaging size 1
- Net weight 0.001 kg
- Country of origin China
- European customs tariff number 85366990
- eCl@ss 27460201 PCB connector (board connector)
- Ficha técnica
- Hoja tipo
- Datos CAD en 3D
