Properties Overview
Connectors, Male connector, Reflow soldering termination (SMT), Contacts: 22, Straight, Copper alloy, Au over Pd/Ni, Mating side, Tin plated, Termination side, Performance level: 1, Liquid crystal polymer (LCP)
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Identificación
- Categoría Connectors
- Serie har-flex®
- Identificación Signal
- Elemento Male connector
- Descripción del contacto Straight
Versión
- Método de terminación Reflow soldering termination (SMT)
-
Tipo de conexión
Motherboard to daughtercardMezzaninePCB to cable
- Número de contactos 22
- Contenidos del paquete Sample
Technical characteristics
- Contact rows 2
- Contact spacing (termination side) 1.27 mm
- Contact spacing (mating side) 1.27 mm
- Stacking height 1.75 mm
- Clearance distance ≥ 0.4 mm
- Creepage distance ≥ 0.4 mm
- Resistencia de aislamiento >109 Ω
- Contact resistance < 25 mΩ
- Limiting temperature -55 ... +125 °C
- Insertion force ≤ 17.6 N
-
Withdrawal force
≥ 3.3 N≤ 15.4 N
- Performance level 1
- Mating cycles ≥ 500
- Test voltage Ur.m.s. 0.5 kV
- Isolation group IIIa (175 ≤ CTI < 400)
Material properties
- Material (insert) Liquid crystal polymer (LCP)
- Material (contacts) Copper alloy
-
Surface (contacts)
Noble metal over Ni Mating sideSn over Ni Termination side
- Material flammability class acc. to UL 94 V-0
- RoHS compliant
- ELV status compliant
- China RoHS e
- REACH Annex XVII substances Not contained
- REACH ANNEX XIV substances Not contained
- REACH SVHC substances Not contained
- California Proposition 65 substances Not contained
Datos comerciales
- Tamaño del embalaje 1
- Peso neto 3.792 g
- País de origen China
- Número europeo de arancel aduanero 85366990
- GTIN 5713140116238
- eCl@ss 27460201 PCB connector (board connector)
- ETIM EC002637
- UNSPSC 24.0 39121415
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