Features
Método de terminación de los elementos de sujeción: SMT
Version
Termination method
Terminación de soldadura por reflujo (THR)
Connection type
De placa madre a tarjeta hija
Mezzanine
Number of contacts
6
Details
Según la norma IEC 61984, se trata de un conector no encapsulado. El usuario debe garantizar la protección contra descarga eléctrica mediante el tipo de instalación apropiada.
Pack contents
200 piezas en bobina
Technical characteristics
Contact spacing (termination side)
2,54 mm
Contact spacing (mating side)
2,54 mm
Stacking height
9,05 mm
Rated current
20 A
Rated voltage
180 V
Rated voltage
conforme a IEC 60664-1
Rated impulse voltage
1,5 kV
Pollution degree
2
Clearance distance
≥0.94 mm
Creepage distance
≥0.94 mm PCB
≥1.89 mm Connector
Insulation resistance
>1010 Ω
Contact resistance
≤ 25 mΩ
Limiting temperature
-55 ... +125 °C
Performance level
1
Mating cycles
≥ 500
Test voltage Ur.m.s.
0,84 kV
Isolation group
IIIa (175 ≤ CTI < 400)
Moisture Sensitivity Level (MSL)
1 acc. to ECA/IPC/JEDEC J-STD-020D
Process Sensitivity Level (PSL)
R0 acc. to ECA/IPC/JEDEC J-STD-020D
Coplanarity of contacts
0,1 mm
Material properties
Material (insert)
Liquid crystal polymer (LCP)
Colour (insert)
Black
Material (contacts)
Copper alloy
Surface (contacts)
Noble metal over Ni Mating side
Sn over Ni Termination side
Material flammability class acc. to UL 94
V-0
RoHS
compliant
ELV status
compliant
China RoHS
e
REACH Annex XVII substances
Not contained
REACH ANNEX XIV substances
Not contained
REACH SVHC substances
Not contained
California Proposition 65 substances
Not contained