Resumen de caracterísiticas
Carrier for electronic components
Interconnection
PCB assembly (SMD)
Polyphthalamide (PPA)
Surface (contacts): Au (≥ 0.05 µm) over Ni (≥ 4 µm) over Cu (5...11 µm)
Detalles del producto
Identification
- Category Surface Mount Device
- Series 3D-MID
- Element Carrier for electronic components
- Specification Interconnection
- Features Other materials or trace layouts on request!
Version
- Fixing PCB assembly (SMD)
-
Pack contents
Tape & reel3400 pieces on reelLower quantities available on request!
Technical characteristics
- Operating temperature -40 ... +125 °C
- Storage temperature -40 ... +125 °C
Material properties
- Material Polyphthalamide (PPA)
- Surface (contacts) Au (≥ 0.05 µm) over Ni (≥ 4 µm) over Cu (5...11 µm)
- Length 4.9 mm
- Width 4 mm
- Height 3 mm
Commercial data
- Packaging size 1,700
- Net weight 0.271 g
- Country of origin Switzerland
- GTIN 5713140327580
- eCl@ss 27469090 PCB connection technology (other, unspecified)
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