Eigenschaften im Überblick
Connector
Reflow soldering termination (SMT)
Contacts: 80
Copper alloy
Noble metal over Ni Mating side, Sn over Ni Termination side
Performance level: 1
Liquid crystal polymer (LCP)
Black
Produktdetails
Identification
- Category Connectors
- Series har-flex®
- Identification HD-Card Edge
- Element Connector
Version
- Termination method Reflow soldering termination (SMT)
-
Connection type
Motherboard to daughtercardMezzanine
- Number of contacts 80
- Pack contents Sample
Technical characteristics
- Contact rows 2
- Contact spacing (termination side) 0.8 mm
- Contact spacing (mating side) 0.8 mm
- Data rate 25 Gbit/s
-
Clearance distance
≥0.2 mm Backplane≥0.53 mm Connector≥0.1 mm Daughtercard
-
Creepage distance
≥0.2 mm Backplane≥0.53 mm Connector≥0.1 mm Daughtercard
- Limiting temperature -55 ... +125 °C
- Insertion force ≤ 55 N
- Withdrawal force ≥ 16 N
- Performance level 1
- Mating cycles ≥ 200
- Isolation group IIIa (175 ≤ CTI < 400)
- Moisture Sensitivity Level (MSL) 1 acc. to ECA/IPC/JEDEC J-STD-020D
- Process Sensitivity Level (PSL) R0 acc. to ECA/IPC/JEDEC J-STD-020D
- Coplanarity of contacts ≤ 0.13 mm
Material properties
- Material (insert) Liquid crystal polymer (LCP)
- Colour (insert) Black
- Material (contacts) Copper alloy
-
Surface (contacts)
Noble metal over Ni Mating sideSn over Ni Termination side
- Material flammability class acc. to UL 94 V-0
- RoHS compliant
- ELV status compliant
- China RoHS e
- REACH Annex XVII substances Not contained
- REACH ANNEX XIV substances Not contained
- REACH SVHC substances Not contained
- California Proposition 65 substances Not contained
Commercial data
- Packaging size 1
- Country of origin China
- European customs tariff number 85366990
- GTIN 5713140205437
- ETIM EC002637
- eCl@ss 27460201 PCB connector (board connector)
Downloads
Download Datenpaket
Wissen
0
Vergleichen
