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Part number: 09 66 162 6812
DSUB SV MA SSDP ANG73-254 09P AU2
DSUB SV MA SSDP ANG73-254 09P AU2

Image is for illustration purposes only. Please refer to product description.

Properties Overview
Connector
Wave soldering termination
Rated current: ‌7.5 A
Male
Size: D-Sub 1
Thermoplastic resin, glass-fibre filled (PBTP), Shell: Plated steel
Black
Contacts: 9 With grounding pin
Copper alloy
Noble metal over Ni
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Part number: 09 66 162 6812
DSUB SV MA SSDP ANG73-254 09P AU2
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Product Details
Identification
  • Category 连接器
  • Series D-Sub
  • Identification 标准
  • Element 连接器
  • Description of the contact
    车削
    弯式
Version
  • Termination method 波峰焊接接线方式
  • Gender 公头
  • Size D-Sub 1
  • Connection type 主板到子插件板
  • Number of contacts 9
  • further contacts 有接地针
  • Termination length 3 mm
  • PCB fixing 带锁板扣
  • Locking type 带螺纹的固定法兰 4-40 UNC
技术参数
  • Distance between rows 2.54 mm
  • Contact spacing (termination side) 2.74 mm
  • Rated current ‌ 7.5 A
  • 放电距离 ≥ 1 mm
  • 爬电距离 ≥ 1 mm
  • Insulation resistance >1010 Ω
  • 接触电阻 ≤ 10 mΩ
  • 拧紧力矩 ≤0.6 Nm 母螺钉锁扣
  • 极限温度 -55 ... +125 °C
  • 插入力 ≤ 30 N
  • 拔出力
    ≥ 3.3 N
    ≤ 20 N
  • 性能等级
    2
    符合 CECC 75301-802 标准
  • Mating cycles ≥ 250
  • 测试电压U r.m.s. 1 kV
  • 绝缘组 IIIa (175 ≤ CTI < 400)
  • PCB 厚度 ≥1.6 mm
  • 安装高度 ‌ 7.3 mm
  • Hot plugging
材料特性
  • 材料(插芯)
    热塑性树脂,玻璃纤维填充(PBTP)
    外壳:镀钢
  • 颜色(插芯) 黑色
  • 材料(插针) 铜合金
  • 表面(插针) 镍表面镀贵金属
  • 材料阻燃性等级符合 UL 94 V-0
  • RoHS 符合豁免标准
  • RoHS 豁免 6(c):铜合金含铅量高达 4 %
  • ELV 状态 符合豁免标准
  • China RoHS 50
  • REACH 附件 XVII 物质 不包含
  • REACH 附件 XIV 物质 不包含
  • REACH SVHC 物质
  • REACH SVHC 物质
  • ECHA SCIP 编号 ecef7555-f643-4ceb-a337-fc54762297f1
  • 加州 65 号提案物质
  • 加州 65 号提案物质
    三氧化二抗
  • 铁路车辆防火 EN 45545-2 (2020-08)
  • 包含危险等级的要求集 R26
规格和认证
  • 规格 DIN 41652
  • UL / CSA UL 1977 ECBT2.E102079
Commercial data
  • Packaging size 100
  • Net weight 0.082 g
  • Country of origin 中国
  • European customs tariff number 85366990
  • GTIN 5713140081352
  • ETIM EC001136
  • eCl@ss 27440214 D-Sub coupler
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HARTING Device Connectivity
HARTING Device Connectivity - Chapter 05
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