Properties Overview
Female connector
Reflow soldering termination (SMT)
Contacts: 30
Straight
Copper alloy
Noble metal over Ni Mating side, Sn over Ni Termination side
Performance level: 1
Liquid crystal polymer (LCP)
Product Details
Identification
- Category Steckverbinder
- Series har-flex®
- Identification Signal
- Element Federleiste
- Description of the contact gerade
Version
- Termination method Reflowlötanschluss (SMT)
-
Connection type
Motherboard to daughtercardMezzanine
- Number of contacts 30
- Pack contents Musterbestellung
Technical characteristics
- Contact rows 2
- Contact spacing (termination side) 1,27 mm
- Contact spacing (mating side) 1,27 mm
- Stacking height 6,25 mm
- Clearance distance ≥ 0,4 mm
- Creepage distance ≥ 0,4 mm
- Insulation resistance >109 Ω
- Contact resistance < 25 mΩ
- Limiting temperature -55 ... +125 °C
- Insertion force ≤ 24 N
-
Withdrawal force
≥ 4,5 N≤ 21 N
- Performance level 1
- Mating cycles ≥ 500
- Test voltage Ur.m.s. 0,5 kV
- Isolation group IIIa (175 ≤ CTI < 400)
Materialeigenschaften
- Material (insert) Liquid-crystal polymer (LCP)
- Material (contacts) Kupferlegierung
-
Surface (contacts)
Edelmetall über Ni steckseitigSn über Ni anschlussseitig
- Material flammability class acc. to UL 94 V-0
- RoHS konform
- ELV Status konform
- China RoHS e
- REACH Annex XVII Stoffe nicht enthalten
- REACH ANNEX XIV Stoffe nicht enthalten
- REACH SVHC Stoffe nicht enthalten
- California Proposition 65 substances nicht enthalten
Commercial data
- Packaging size 1
- Net weight 1 g
- Country of origin China
- European customs tariff number 85366990
- GTIN 5713140117891
- ETIM EC002637
- eCl@ss 27460201 Leiterplattensteckverbinder (Platinenanschluss)
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