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Part number: 15 75 626 2601 000
har-flex Hybrid M ang 6+26 SMT PL1 400pc
har-flex Hybrid M ang 6+26 SMT PL1 400pc

Image is for illustration purposes only. Please refer to product description.

Properties Overview
Male connector
Reflow soldering termination (SMT)
Rated current: ‌22.5 A
Contacts: 32
Angled
Copper alloy
Noble metal over Ni Mating side, Sn over Ni Termination side
Performance level: 1
Liquid crystal polymer (LCP)
Black
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Part number: 15 75 626 2601 000
har-flex Hybrid M ang 6+26 SMT PL1 400pc
Notes
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Product Details
Identification
  • Catégorie Connectors
  • Série har-flex®
  • Identification Hybrid
  • Elément Male connector
  • Description du contact Angled
Version
  • Méthode de raccordement Reflow soldering termination (SMT)
  • Type de connexion
    Motherboard to daughtercard
    Extender card
  • Nombre de contacts 32
  • Nombre de contacts de signal 26
  • Nombre de contacts de puissance 6
  • Contenu du kit 400 pieces on reel
Données techniques
  • Ecart entre les contacts (côté de raccordement)
    1.27 mm
    2.54 mm
  • Ecart entre les contacts (côté accouplement)
    1.27 mm
    2.54 mm
  • Intensité nominale ‌ 22.5 A
  • Tension nominale
    ‌ 50 V AC
    ‌ 120 V DC
  • Tension nominale acc. to IEC 60664-1
  • Tension de claquage 1.5 kV
  • Degré de pollution 2
  • Distance d'isolement
    ≥0.4 mm Signal contacts
    ≥1.74 mm Power contacts
    ≥1.11 mm Signal to power contacts
  • Ligne de fuite
    ≥0.4 mm PCB: Signal contacts
    ≥1.74 mm PCB: Power contacts
    ≥1.11 mm PCB: Signal to power contacts
    ≥0.4 mm Connector: Signal contacts
    ≥1.89 mm Connector: Power contacts
    ≥1.99 mm Connector: Signal to power contacts
  • Résistance d'isolement >1010 Ω
  • Résistance de contact ≤ 25 mΩ
  • Limite de température -55 ... +125 °C
  • Classe de performance 1
  • Cycles de connexion ≥ 500
  • Tension d’essai Ur.m.s.
    0.5 kV Signal
    1.39 kV Signal / Power
    1.39 kV Power / Power
  • Groupe d'isolation IIIa (175 ≤ CTI < 400)
  • Moisture Sensitivity Level (MSL) 1 acc. to ECA/IPC/JEDEC J-STD-020D
  • Process Sensitivity Level (PSL) R0 acc. to ECA/IPC/JEDEC J-STD-020D
  • Coplanarité des contacts ‌ 0.12 mm
Propriétés du matériau
  • Matériau (insert) Liquid crystal polymer (LCP)
  • Couleur (d'insert) Black
  • Matériau (contacts) Copper alloy
  • Surface (contacts)
    Noble metal over Ni Mating side
    Sn over Ni Termination side
  • Classe d'inflammabilité du matériau conformément à UL 94 V-0
  • RoHS compliant
  • État ELV compliant
  • China RoHS e
  • Substances REACH ANNEXE XVII Not contained
  • Substances REACH ANNEXE XIV Not contained
  • Substances REACH SVHC Not contained
  • Proposition Californie 65 substances Not contained
Spécifications et homologations
  • UL / CSA
    UL 1977 ECBT2.E102079
    CSA-C22.2 No. 182.3 ECBT8.E102079
Informations commerciales
  • Dimensions du produit conditionné 1
  • Poids net 2,000 g
  • Pays d'origine China
  • Numéro de tarif douanier européen 85366990
  • GTIN 5713140204904
  • ETIM EC002637
  • eCl@ss 27460201 PCB connector (board connector)
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