3D-MID Carrier for electronic components | HARTING Technology Group

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Carrier for electronic components

Carrier_BT807042

Artículo nº:78 01 030 0006

Interconnection
PCB assembly (SMD)
Liquid crystal polymer (LCP)
Surface (contacts): Au (≥0.05 µm) over Ni (≥4 µm) over Cu (5...11 µm)

Carrier_BT807042

Carrier for electronic components

Carrier_BT494030_SOT23-6_h

Artículo nº:78 01 030 0003

Interconnection
PCB assembly (SMD)
Liquid crystal polymer (LCP)
Surface (contacts): Au (≥0.05 µm) over Ni (≥4 µm) over Cu (5...11 µm)

Carrier_BT494030_SOT23-6_h

Carrier for electronic components

Carrier_BT807042

Artículo nº:78 01 030 0004

Interconnection
PCB assembly (SMD)
Liquid crystal polymer (LCP)
Surface (contacts): Au (≥0.05 µm) over Ni (≥4 µm) over Cu (5...11 µm)

Carrier_BT807042

Carrier for electronic components

Carrier_BT494030_SOT23-3_v

Artículo nº:78 01 030 0005

Interconnection
PCB assembly (SMD)
Liquid crystal polymer (LCP)
Surface (contacts): Au (≥0.05 µm) over Ni (≥4 µm) over Cu (5...11 µm)

Carrier_BT494030_SOT23-3_v

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