Properties Overview
Carrier for electronic components
Interconnection
PCB assembly (SMD)
Liquid crystal polymer (LCP)
Surface (contacts): Au (≥ 0.05 µm) over Ni (≥ 4 µm) over Cu (5...11 µm)
Product Details
Identification
- Category Surface Mount Device
- Series 3D-MID
- Element Carrier for electronic components
- Specification Interconnection
- Features Other materials or trace layouts on request!
Version
- Fixing PCB assembly (SMD)
-
Pack contents
Tape & reel1200 pieces on reelLower quantities available on request!
Technical characteristics
- Operating temperature -40 ... +125 °C
- Storage temperature -40 ... +125 °C
Material properties
- Material Liquid crystal polymer (LCP)
- Surface (contacts) Au (≥ 0.05 µm) over Ni (≥ 4 µm) over Cu (5...11 µm)
- Length 8 mm
- Width 7 mm
- Height 4.2 mm
- RoHS compliant
- ELV status compliant
- China RoHS e
- REACH Annex XVII substances Not contained
- REACH ANNEX XIV substances Not contained
- REACH SVHC substances Not contained
- California Proposition 65 substances Not contained
Commercial data
- Packaging size 600
- Net weight 1.224 g
- Country of origin Switzerland
- European customs tariff number 85340019
- GTIN 5713140277397
- ETIM EC002637
- eCl@ss 27469090 PCB connection technology (other, unspecified)
Downloads
Download Package
Knowledge
0
Compare
