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Device connectivity
PCB connectors
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Board to board connectors
Mezzanine connection
15 72 416 2601 333
部品番号: 15 72 416 2601 333
har-flex Hybrid M str 4+16 SMT PL1Sample
画像は一例です。製品詳細を参照ください。
Properties Overview
Male connector
Reflow soldering termination (SMT)
Contacts: 20
Straight
Copper alloy
Noble metal over Ni Mating side, Sn over Ni Termination side
Performance level: 1
Liquid crystal polymer (LCP)
Black
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部品番号: 15 72 416 2601 333
har-flex Hybrid M str 4+16 SMT PL1Sample
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Free Sample
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製品詳細
Identification
Category
Connectors
Series
har
-flex
®
Identification
Hybrid
Element
Male connector
Description of the contact
Straight
Version
Termination method
Reflow soldering termination (SMT)
Connection type
Motherboard to daughtercard
Mezzanine
Number of contacts
20
Number of signal contacts
16
Number of power contacts
4
Pack contents
Sample
Technical characteristics
Contact spacing (termination side)
1.27 mm
2.54 mm
Contact spacing (mating side)
1.27 mm
2.54 mm
Stacking height
3.25 mm
Rated voltage
50 V AC
120 V DC
Rated voltage
acc. to IEC 60664-1
Rated impulse voltage
1.5 kV
Pollution degree
2
Clearance distance
≥0.4 mm Signal contacts
≥1.74 mm Power contacts
≥1.11 mm Signal to power contacts
Creepage distance
≥0.4 mm PCB: Signal contacts
≥1.74 mm PCB: Power contacts
≥1.11 mm PCB: Signal to power contacts
≥0.4 mm Connector: Signal contacts
≥1.89 mm Connector: Power contacts
≥1.94 mm Connector: Signal to power contacts
Insulation resistance
>10
10
Ω
Contact resistance
≤ 25 mΩ
Limiting temperature
-55 ... +125 °C
Performance level
1
Mating cycles
≥ 500
Test voltage U
r.m.s.
0.5 kV Signal
1.39 kV Signal / Power
1.39 kV Power / Power
Isolation group
IIIa (175 ≤ CTI < 400)
Moisture Sensitivity Level (MSL)
1 acc. to ECA/IPC/JEDEC J-STD-020D
Process Sensitivity Level (PSL)
R0 acc. to ECA/IPC/JEDEC J-STD-020D
Coplanarity of contacts
0.12 mm
Material properties
Material (insert)
Liquid crystal polymer (LCP)
Colour (insert)
Black
Material (contacts)
Copper alloy
Surface (contacts)
Noble metal over Ni Mating side
Sn over Ni Termination side
Material flammability class acc. to UL 94
V-0
RoHS
compliant
ELV status
compliant
China RoHS
e
REACH Annex XVII substances
Not contained
REACH ANNEX XIV substances
Not contained
REACH SVHC substances
Not contained
California Proposition 65 substances
Not contained
Specifications and approvals
UL / CSA
UL 1977 ECBT2.E102079
CSA-C22.2 No. 182.3 ECBT8.E102079
Commercial data
Packaging size
1
Country of origin
China
European customs tariff number
85366990
GTIN
5713140204775
ETIM
EC002637
eCl@ss
27460201 PCB connector (board connector)
Downloads
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Documentation
Data Sheet
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PDF (Brazilian Portuguese)
PDF (German)
PDF (Spanish)
PDF (Hungarian)
PDF (Italian)
PDF (French)
PDF (Korean)
PDF (Russian)
PDF (Japanese)
PDF (Polish)
PDF (Chinese)
PDF (Romanian)
PDF (Chinese trad.)
PDF (English)
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The data sheet in PDF format describes the general and technical properties of the product, lists the applied standards and approvals and serves as documentation.
Type Sheet
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PDF
CGM
DXF
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The type sheet is a 2D figure of the product. It is available in file formats PDF, CMG and DXF.
Product Declaration
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PDF (English)
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The product declaration in PDF format documents the conformity of the product with various standards such as RoHS, REACH, ELV etc.
Engineering Data
3D CAD Data
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STEP
JT
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Neutral 3D CAD data for all common CAD tools. They can be used for a quick and easy use of HARTING products in CAx engineering processes.
PCB Multi ECAD Data
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Over 20 different formats for all common PCB software design tools. The data packages consist of footprints, circuit symbols and 3D CAD data. They can be used for a quick and easy integration of HARTING products in CAx engineering processes.
Click
here
for further information.
Further Documents
Asset Administration Shell
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AAS
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The AAS data is organised in a structured way according to an open standard from IDTA (
International Digital Twin Association
), using a data model that allows different systems and applications to interact with the Asset Administration Shell in a standardised and interoperable way. This enables seamless integration and communication between different systems and applications. Further information can be found
here
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Catalogues & Brochures
Selection Guide for Mezzanine Applications
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